Assembly On A 3D Molded Interconnect Device

This video from Häcker Automation shows their test of an assembly operation for a 3D Multi Interconnect Device (aka 3D MID). Processes in the video include dispensing of solder paste, pick and place of components (LEDs in this case) and micro laser soldering. The laser soldering process is also shown from the perspective of the camera on the soldering unit’s head.

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